Halbleiterbauelement mit einer Flaechenhalbleiteranordnung zwischen durch Federdruck angepressten Elektrodenkontaktplatten

摘要

1,094,960. Semi-conductor devices. CKD PRAHA OBOROVY PODNIK. Dec. 21, 1965 [Dec. 22, 1964], No. 54056/65. Heading H1K. The devices described are semi-conductor diodes in which the semi-conductor element is held under spring pressure between electrode plates. In each, the spring is held in compression by a two-part structure bonded to the base 1 of the housing. In the diode of Fig. 2, one of these parts 71 is preformed with a groove 91 in a strengthened rim and is bonded to the base. The semi-conductor element and electrode assembly are placed in position, an insulating washer 5 placed on the upper electrode plate 3 (anode), and the spring washers 6 put on. The second compression part 81 is slipped over the first part and controlled pressure is applied to compress the spring to the desired degree. At this point a tool 107 (Fig. 3, not shown), is used to impress the walls of the second part 81 into the groove 91 on the first part. This maintains the spring pressure in the completed device at the predetermined value since the impressing tool operates at exactly the height of the centre of the symmetrically formed groove 91. A polytetrafluoro-ethylene ring 15 is placed in the groove now formed in the second part and the cover of the container then resistance-welded to the lip 12 on the first compression part 71. The ring 15 acts as a seal to prevent contaminants formed in this process from reaching the semiconductor. The diode of Fig. 1 (not shown), is similar but here the preformed groove is in an annular second compression part (8) fitting within the first part (7) which is fixed to the housing and the walls of which are impressed into the groove to maintain the predetermined spring pressure. It is suggested that, in general, methods other than beading one part into a groove in the other may be used to retain the two parts in their desired relative positions.