| 摘要 |
PURPOSE:To provide a semiconductor which prevents the edge touch caused by the deformation of a bonding wire, the short circuit with the semiconductor substrate occurring when a ball bonding comes to the vicinity of the edge of a chip, or the short circuit between pins. CONSTITUTION:This semiconductor device is equipped with a plurality of bonding pads, which are made on a semiconductor substrate 11, and impurity diffusion areas 17, which are provided, independently for each bonding pad 13, in the regions ranging from these bonding pads 13 to chip edge in the direction of a scribe line, and become electric floatings. |
