| 摘要 |
PURPOSE:To bond a metal wire efficiently and positively to an electrode pad by suppressing the impact load of actual load to be exerted on the electrode pad substantially equal to a set load and transmitting ultrasonic vibration energy efficiently. CONSTITUTION:When an electrode pad 12 of a semiconductor element 1 secured to a die pad 21 of a lead frame 2 is bonded through a copper wire 3 fed from a capillary 6 to an inner lead 22, the copper wire 3 is heated at the end thereof to produce a copper ball 31 which is bonded to the electrode pad 12. In such method for fabricating a semiconductor device, load for pressing the copper ball 31 to the bonding face is switched from low load F1 to high load F2 and ultrasonic vibration is exerted on the copper ball 31 simultaneously with application of high load F2. |
