发明名称 Flux for (automatic) soldering - is soln of adipic acid and excess high-boiling alcohol(s) in organic solvent
摘要 <p>Soldering flux, consisting of a soln. of cpds. contg. COOH gps. in an organic solvent, contains 0.5-25 wt.% adipic acid and alcohol(s) with b.pt. 70-30 degrees C below the soldering temp., in amt. to give 1.5-5 OH/COOH gp. This flux is esp. useful for automatic soldering, e.g. of printed circuits. Adipic acid has an excellent etching effect and reacts readily with the alcohol component during soldering, forming a harmless linear polyester. The flux pref. contains 2-8 wt.% adipic acid and 2-3 OH/COOH, the alcohol pref. having b.pt. 60-50 degrees C below the soldering temp. and being a dihydric alcohol, esp. ethylene glycol.</p>
申请公布号 DE2114927(A1) 申请公布日期 1972.10.05
申请号 DE19712114927 申请日期 1971.03.27
申请人 WILHELM PAFF OHG FA 发明人
分类号 B23K35/36;(IPC1-7):23K35/36 主分类号 B23K35/36
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