| 摘要 |
PURPOSE:To adjust the parallelism of a tool with a stage extremely simply, with good efficiency and high accuracy. CONSTITUTION:The title bonding apparatus is provided with the following: a base 13 as a base stand; a stage 12 which is placed on the base 13 and on which a semiconductor chip 19 is mounted; and a tool 11 which is raised, lowered and driven so as to be faced with the stage 12. The base 13 in which a semispherical recessed part 22 has been formed is cylindrical and houses the stage 12. The stage 12 is semispherical, and its surface is a flat mounting face 12a on which the semiconductor chip 19 is mounted. The surface of the recessed part 22 is filled with a lubricant so that the stage 12 and the base 13 can be tilted smoothly to all directions. In addition, a hydraulic suction pipe 14 which sucks the stage 12 hydraulically is installed in the base 13. |
