发明名称 |
THERMOSETTING RESIN COMPOSITION |
摘要 |
<p>Novel thermosetting resinous compositions are disclosed. The compositions comprise the reaction product of a polymeric polyol having a cured glass transition temperature less than 20 DEG C. with a substantial stoichiometric excess of an aminoplast curative. The cured compositions are hard with good durability and surprising flexibility for such high aminoplast loadings.</p> |
申请公布号 |
JPS53110649(A) |
申请公布日期 |
1978.09.27 |
申请号 |
JP19780026466 |
申请日期 |
1978.03.07 |
申请人 |
PPG INDUSTRIES INC |
发明人 |
SAMIYUERU POOTAA JIYUNIAA;ROJIYAA RUISU SUKURAIBUN;UENNSHIYUAN CHIYAN;JIEIMUZU BURENDAN ODOWAIYAA |
分类号 |
C08L61/00;C08L61/20;C08L67/00;C08L71/00;C08L71/02;C09D133/14;C09D161/20;C09D167/00;C09D175/04;C09D179/02;C09D201/06 |
主分类号 |
C08L61/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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