发明名称 THERMOSETTING RESIN COMPOSITION
摘要 <p>Novel thermosetting resinous compositions are disclosed. The compositions comprise the reaction product of a polymeric polyol having a cured glass transition temperature less than 20 DEG C. with a substantial stoichiometric excess of an aminoplast curative. The cured compositions are hard with good durability and surprising flexibility for such high aminoplast loadings.</p>
申请公布号 JPS53110649(A) 申请公布日期 1978.09.27
申请号 JP19780026466 申请日期 1978.03.07
申请人 PPG INDUSTRIES INC 发明人 SAMIYUERU POOTAA JIYUNIAA;ROJIYAA RUISU SUKURAIBUN;UENNSHIYUAN CHIYAN;JIEIMUZU BURENDAN ODOWAIYAA
分类号 C08L61/00;C08L61/20;C08L67/00;C08L71/00;C08L71/02;C09D133/14;C09D161/20;C09D167/00;C09D175/04;C09D179/02;C09D201/06 主分类号 C08L61/00
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