CERAMIC CIRCUIT BOARD AND SEMICONDUCTOR DEVICE

摘要

PURPOSE:To obtain a circuit board wherein it is excellent in the connection property and the reliability of a bonding wire, its size is small and its cost is low by a method wherein a thick-film conductor used to connect the bonding wire is composed of a two-layer metal-component structure by an upper-layer conductor and a lower-layer conductor which are respectively specific. CONSTITUTION:A ceramic circuit board 2 is provided with the following: a ceramic substrate 21; a thick-film conductor 1 which is formed on it and which is used to connect a bonding wire 3; and a wiring conductor film 5 on which a semiconductor element 4 is mounted. The ceramic circuit board 2 is composed of a two-layer metal-component structure by an upper-layer conductor 11 which is used to connect the bonding wire 3 and by a lower-layer conductor 12. The upper-layer conductor 11 and the lower-layer conductor 12 are composed of a silver-palladium conductor which has been formed by baking and alloying silver and palladium. The lower-layer conductor 12 is composed of a sintered substance which contains at least 70wt.% of silver and 0 to 30wt.% of palladium; the content by percentage of the palladium in the upper-layer conductor 11 is set to be by 5 to 20wt.% more than the content by percentage of the palladium in the lower-layer conductor 12.