| 摘要 |
<p>PURPOSE:To enable to obtain a defectless and beautiful cleavage face in the base of the dovetail groove of a wafer at a higher yield as well as to improve the sharpeness of a split-cutting tool to be used for forming the dovetail groove by a method wherein the dovetail groove is formed in the single crystal wafer and the single crystal wafer is made a split-cutting by making the split-cutting tool, which has a point angle of 55 deg. to 75 deg. and has been made to diamond, abut to the dovetail groove. CONSTITUTION:A selective etching is performed on a single crystal wafer 16 along a split-cutting programming line 13, where a cleavage of the wafer 16 is created, and a dovetail groove 22 with its almost flat base 21 is formed. A split-cutting tool 8; which has a point angle of 55 deg. to 75 deg., has a V-shaped cross section and has been made of diamond; is made to abut to the base 21 of the groove 22, and while the split-cutting tool 8 keeps on shifting in such a way as to correspond to the single crystal wafer 16 along the split-cutting programming line 13, the single crystal wafer 16 is made a split-cutting. According to this method, even though there exists an angle difference between the extending directioi of the dovetail groove 22 and the cleavage direction, it can be prevented for the trace of the split-cutting face, in short, the cracking lines, to cut in the inclined plane, so long as there exists the celavaqe face in the base of the dovetail groove 22.</p> |
