| 摘要 |
PURPOSE:To facilitate bonding of material using tin and solder and also improve the life span of tool by coating the bonding surface of bonding machine with a ceramic material which is superior in thermal impact resistance and friction resistance and is chemically stable for metal. CONSTITUTION:An IC bump 3a is formed on the surface around an IC chip 3 and the end part of a finger 2 is bonded to said bump using a metal tool 1a forming a bonding machine. In such structure, the lower surface of tool 1a is coated with the cearamic material 1b which is superior in the thermal resistance and friction resistance by 4-6 times in comparison with a metal such as Inconel. Thereby, if the finger 2 is made of thi or solder, a number of times of grinding for repair of tool 1a can be reduced, the life span can be extended and bonding quality can also be improved.
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