| 摘要 |
PURPOSE:To attain uniformly cooling a part to be cooled by absorbing flowed heat by a module of other stage than a module cooling directly the part to be cooled. CONSTITUTION:The part 2 to be cooled surrounded by a case 1 is connected to an external part by a heat flowing path 3 such as a waveguide. Further, the part 2 to be cooled directly by a thermoelectronic module 4. Metallic foils or thin plates 10, 11 with excellent heat conduction are contacted with the cooling side of cooling modules 5, 6 with a margin to the absorbed heat at a stage lower than the module 4 and the result is connected to the case 1 and the heat path 3. Thus, the capability of the cooling module 4 is compensated and an external heat input is bypassed to the cooling modules 5, 6 at the lower part so as to cool uniformly the part 2 to be cooled. |
