| 摘要 |
<p>METHOD OF FABRICATING A SUBSTRATE WHICH INCLUDES ONE OR MORE APERTURES THERETHROUGH A substrate for an electronic circuit, which includes one or more apertures therethrough, is manufactured by cutting one or more slots in an edge of a first slab of substrate material; metalizing the slotted edge; metalizing a mating edge of a second slab of the substrate material; securing together the metalized edges of the first and second slabs to create the apertures through the combined slabs from an upper surface to a lower surface thereof. The combined slabs may use as a single substrate or may be sliced in a direction normal to the respective apertures into two or more substrates. A printed circuit pattern can be formed on one of the upper and lower surfaces of the formed substrate. Metalization of the other surface of the substrate can be connected to a septum formed by the metalized edges of the respective slabs.</p> |
