| 摘要 |
PURPOSE:To make it possible to control the temperature at the time of bonding at an adequate temperature, by obtaining information as to whether an IC container is within a range of adequate temperature conditions or not when a semiconductor element is bonded. CONSTITUTION:A first metal thin film 16, which has a melting point in the vicinity of the melting temperature of a low-melting-point glass 15 for bonding elements, is provided at a part of a lead frame 14, but the melting point of the film 16 is higher than the melting point of the glass 15. A second metal thin film 17, which has a melting point in the vicinity of the melting point of low-melting-point glass 13 for packaging, is provided at another part of the lead frame 14, but the melting point of the film 17 is lower than the melting point of the glass 13. When a semiconductor element is bonded, the fact that the first metal thin film 16 is fused but the second metal film 17 is not fused is optically monitored. Thus the element can be bonded under adequate temperature conditions.
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