| 摘要 |
<p>PURPOSE:To form small-sized and highly reliable parts by executing a first fixing process, a process for attaching and detaching a circuit board and a second fixing process, and by fixing and connecting them between first and second circuit boards under the condition where chip parts are erected to a wiring pattern. CONSTITUTION:After chip resistor 2 and a first circuit board 14 is positioned, a pressing body 18 in which a heater 19 is mounted in the inside thereof is mounted on the first circuit board 14, which is heated as it is pressed. Here a solder layer 16 is fused and a second terminal 2b of the chip resistor 2 and a placing pad 13 are fixed. Thereafter the first circuit board 14 on which the chip resistor 2 is fixed by the use of a vacuum chuck is lifted upward and taken out from a supporting stage 10 and a guide plate 12. Finally, a second circuit board 24 is placed so as to abut against a first terminal 2a of the chip resistor 2 and also fixed by soldering. Thereby highly dense, good radiative, highly reliable mounting structure can be obtained because the chip parts are erected longitudinally and arranged under the condition of good position precision and stability.</p> |
