| 摘要 |
A method and apparatus for surface mounting terminals on a substrate, in particular, pin terminals on a printed circuit board, having solder applied therein. In the first step of the method, a plurality of terminals are inserted in a holding fixture and held in alignment with each other. The holding fixture is then rotated to bring the terminals into contact with the solder on the substrate. In the next step of the method, the area of contact is heated, for example, by infra-red radiation, until reflow of the solder occurs. After heating, the heated solder is allowed to cool, i.e. solidify, thereby forming a secure connection between the terminals and the surface of the substrate.
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