| 摘要 |
PURPOSE:To laminate the arbitrary number of IC packages by a method wherein a housing part used to mount an IC chip is formed in the central part of a printed-circuit board and terminals, for bonding use, connected to electrodes of the IC chip are formed at the circumference of the housing part. CONSTITUTION:IC packages 10A to 10C are provided with external terminal electrodes 3 which are formed vertically on side faces in such a way that the electrodes of coincident functions at the packages are connected mutually. An electrode sheet 20 provided with lead electrodes 9 used to connect respective length directions of the external terminal electrodes 3 in common is installed at the uppermost part of the laminated IC packages; a semiconductor device by a plurality of IC packages is constituted. A hollow part H as an IC-chip housing part by making the central part hollow is formed in a hollow printed- circuit board 1; bonding terminals 2 connected to an IC chip are formed at a periphery of the surface. The external terminal electrodes 3 connected to bonding terminals 2 via respective wires 4 are formed at definite intervals at least on one face of side faces. |
