发明名称 HYBRID MODULE ELECTRONICS PACKAGE
摘要 A Very Large Hybrid Module (VLHM) for packaging electronic components provides a hermetic enclosure formed by a hermetic substrate on which the components are mounted together with a hermetic lid surrounding groups of the components. A second substrate outside the hermetic enclosure is utilized for providing connections between the electronic components.
申请公布号 CA2017340(A1) 申请公布日期 1991.03.27
申请号 CA19902017340 申请日期 1990.05.23
申请人 PLESSEY ELECTRONIC SYSTEMS CORPORATION 发明人 LIGUORI, RALPH;GOLDHAMMER, KURT R.;LAERMER, LOTHAR
分类号 H01L25/18;H01L23/055;H01L23/057;H01L23/10;H01L23/538;H01L25/04;H01L25/16;H05K5/00 主分类号 H01L25/18
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