发明名称 |
HYBRID MODULE ELECTRONICS PACKAGE |
摘要 |
A Very Large Hybrid Module (VLHM) for packaging electronic components provides a hermetic enclosure formed by a hermetic substrate on which the components are mounted together with a hermetic lid surrounding groups of the components. A second substrate outside the hermetic enclosure is utilized for providing connections between the electronic components. |
申请公布号 |
CA2017340(A1) |
申请公布日期 |
1991.03.27 |
申请号 |
CA19902017340 |
申请日期 |
1990.05.23 |
申请人 |
PLESSEY ELECTRONIC SYSTEMS CORPORATION |
发明人 |
LIGUORI, RALPH;GOLDHAMMER, KURT R.;LAERMER, LOTHAR |
分类号 |
H01L25/18;H01L23/055;H01L23/057;H01L23/10;H01L23/538;H01L25/04;H01L25/16;H05K5/00 |
主分类号 |
H01L25/18 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|