| 摘要 |
PURPOSE:To miniaturize by providing at least one out of the leads, which are connected electrically to a first bonding pad, with a part which overlaps a semiconductor pellet. CONSTITUTION:This is constituted by laying an insulating film 2 and a semiconductor pellet 4, respectively, on an inner lead 3A. Accordingly, the inner lead 3A for signal, which is electrically connected to the external terminal being arranged along the farthest side of a semiconductor pellet 1, is drawn around inside the occupied area of the semiconductor pellet 1, and by the amount equivalent to the draw-around of this inner lead 3A for signal, the size of the part 5 for sealing with resin can be reduced. Thus, a semiconductor device 10 sealed with resin of ZIP structure can be miniaturized. |
