| 摘要 |
PURPOSE:To improve reliability and manufacturing yield by eliminating direct application of a stress at the time of wire bonding to a chip in a mount adapted for a semiconductor laser diode or a microwave diode. CONSTITUTION:A mount has a submount 3 for placing a chip 1, and a carrier 7 for placing the submount 3. A recess 4 for containing the chip 1 is provided on the submount 3. The recess 4 has a width such that the chip 1 can be contained in a state that the front and rear surface electrodes 2a, 2b of the chip 1 are opposed in a horizontal direction. Metallized layers 5a, 5b corresponding to the electrodes 2a, 2b of the chip 1 are formed on the front surface of the submount 3 and the side of the recess 4. Metallized layers 9a, 9b of the surface of a carrier 7 are wire bonded to the layers 5a, 5b of the submount 3. |
