| 摘要 |
PURPOSE:To obtain an electronic part mounting method with which solder bridge is hardly generated by securing sufficient coating quantity of cream solder. CONSTITUTION:An electrode 3a is formed by burying it in a printed substrate 10 in such a manner that the upper surface of the electrode 3a of a circuit pattern 3 is positioned lower than the upper surface of the printed subst rate 10. Cream solder 7 is applied to the recessed part 5 of the above-mentioned electrode 3a, and the cream solder 7 is projected a little from the upper surface of the printed substrate 10. Accordingly, the coating quantity of the cream solder 7 can be secured sufficiently, the electrode of an electronic part can be soldered firmly on the electrode 3a of a circuit pattern 3, a solder bridge and a solder ball are hardly generated, and the electronic part can be mounted at a high yield rate. Besides, a screen mask 9 can be thinly formed, the solderability of the cream solder 7 in a pattern hole 11 can be improved, and the transferability to the printed substrate 10 of the cream solder 7 can also be improved. |
