| 摘要 |
PURPOSE:To provide a fully automatic polishing device which realizes uniformity of quality and performs processing of ultra flatness accuracy by processing a plurality of semiconductor wafers in one chuck. CONSTITUTION:The title polishing device is constituted of a base stand 1, a cassette elevator mechanism 2, a cassette mount stand 3, a cassette 4, a wafer carrying-out mechanism 5, a wafer slide plate 6, a wafer carrying-in mechanism 7, a handling robot 8, a vacuum chuck/wafer positioning mechanism 10, a chuck cleaning mechanism 11, a wafer cleaning mechanism 12, a polishing head 13 and a carrier stand 16 provided with sliding mechanisms 14, 15 which are slidable horizontally. |
