CIRCUIT PACKAGE STRUCTURE

摘要

PURPOSE: To form a cubic structure by laminating integrated circuit chips to make a three-dimensional packaging. CONSTITUTION: A first substrate 14 to which a chip 11 is mounted has conductors, one end of each conductor is electrically connected to a chip contact 206 and the other end forms pin-like electric connection mounts 444. The pin-like structure may be formed by a protrusion of the first substrate 14 having the conductors extending to the surface, or otherwise formed as a structure having parts extending like a cantilever from both faces of the end of the first substrate and solder charged in the space therebetween. The pin-like structure may be soldered directly to the conductors on the surface of a second substrate 21 or inserted and coupled in a hole of this substrate.