| 摘要 |
<p>PURPOSE:To provide a lead frame which can equalize and stabilize the thickness of paste film of a semiconductor chip, and can control the direction of flow of paste and the fluidity in the case that the spread of paste is required. CONSTITUTION:A recess 4 is made in the bonding face where the semiconductor chip 1 of a die pad 2 is bonded, and a projection 5 is made around the recess 4. Paste 3 is applied in the recess 4 and as the semiconductor chip 1 is pressed down to the side of the recess 4, a paste bank is made in the recess 4, and the thickness of a film is secured, according to the depth of the recess 4, so surplus paste 3 flows over the projection 5, whereby the film thickness of the paste 3 becomes equal and stable.</p> |
