| 摘要 |
PURPOSE:To increase radiating properties greatly by sealing a base, a semiconductor element and a part of an external leadout lead with resin and by removing a part of the resin and a part of the semiconductor element. CONSTITUTION:Resin and a semiconductor element 101a are removed partially by cutting so that the rear side of the semiconductor element 101a be exposed out of the resin and a high-heat-conductive member 106 is bonded directly on the exposed rear side of the semiconductor element with paste 1O7a. Moreover, a semiconductor device is mounted on a printed circuit board 112 by using solder 114 and the bottom side of the semiconductor device is bonded to a die pad 113 on the printed circuit board 112 with paste 107b. According to this constitution, a heat generated in the semiconductor device can be transmitted efficiently to the high-heat-conductive member 106 or the printed circuit board 112 and radiated therefrom. |
