| 摘要 |
<p>PROBLEM TO BE SOLVED: To improve a soldering quality by accurately positioning a soldering position of a substrate relative to a metal base and preventing unnecessary leak-out of melted solder, based on a capillary penetration soldering method. SOLUTION: The soldering apparatus includes a hot plate 5 disposed within a furnace, a positioning guide 10 of a division structure mounted the metal base as to surround 4 peripheral sides of the substrate on such a condition that a laminate of a metal base 3 and a substrate 1 is mounted on the hot plate, and a pressing pin 8 for pushing a central part of the substrate from its upper side to depress the metal base 3 at the time of soldering. One 10a of peripheral 4 side guides is used also as a molten-solder injecting header so that the guide 10a is formed therein with a molten-solder outlet 10a-2 into which a solder line 9 is inserted, the positioning guides surround the four peripheral sides of the substrate to position the substrate at a predetermined soldering position under such a condition that the substrate is stacked on the metal base. Soldering is carried out by injecting molten solder into a gap between the metal base 3 and substrate 1.</p> |
