ELECTRONIC PACKAGE HAVING CONTROLLED EPOXY FLOW

摘要

There is provided an electronic package assembly having a die attach paddle (20) bonded to the package base (10') by a compliant adhesive (26). A recessed channel (34) formed in the base (10') is partially overlapped by the die attach paddle (20). During package sealing, excess adhesive (26) accumulates in the recessed channel (34), eliminating bridging of the adhesive (26) to the leadframe (16).