| 摘要 |
The arrangement has a pair of spaced electrodes, one covered with solid solder. When the solder melts, both electrodes become covered, and the resulting short circuit is detected by an evaluation unit. The arrangement has a hollow body in a soldering unit (1) partially filled with solder. Two electrodes with spaced free ends are connected to an evaluation unit and protrude into the hollow body. At temperatures below the melting point, at least one wall segment of the hollow body is covered with solidified solder so that the surface of the solder coating is inclined with respect to the horizontal. At least one electrode is not covered by solder. When the melting point is reached, the liquefied solder in the hollow chamber covers both electrodes and the electrical signal produced by the short circuit between the electrodes is detected in the evaluation unit.
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