发明名称 Power bus bar for providing a low impedance connection between a first and second printed circuit board
摘要 The present invention provides a reliable high current connector for connecting the ground and power planes of a first PCB to the ground and power planes of a second PCB. The power bus bar is comprised of a first conductive structure having a first and second surface, a second conductive structure having a first and second, and an inner insulative structure positioned between the first surface of the first conductive structure and the first surface of the second conductive structure. A fastening means, inserted through openings in the conductive structures, provides a secure, low resistance electrical connection from the first or second conductive structure of the bus bar to the electrical traces of the PCB. The high dielectric constant of the insulator provides distributed capacitance between the first conductive structure and the second conductive structure, lowering the AC impedance. The bus bar design mounts both above and below each PCB and increases mechanical strength and spatial efficiency compared to previous bus bar designs.
申请公布号 US6024589(A) 申请公布日期 2000.02.15
申请号 US19970856500 申请日期 1997.05.14
申请人 HEWLETT-PACKARD COMPANY 发明人 HAHN, IV, JOHN W.;KOCH, JAMES K.
分类号 H01R4/30;H01R12/04;H05K1/14;H05K3/32;(IPC1-7):H01R4/60 主分类号 H01R4/30
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