| 摘要 |
<p>PROBLEM TO BE SOLVED: To obtain reliable contact without damaging the external terminal of a semiconductor device by providing an anisotropic conductive sheet with elasticity for allowing the double-sided contact sheet to be stably and reliably brought into contact with the semiconductor. SOLUTION: A contact device is composed of a double-sided contact sheet 4 with a bump, and a metal wire-embedded sheet 5. On the upper surface of the contact sheet 4, a bump 3 is provided at a position corresponding to an external terminal 2 of a semiconductor device 1 to be inspected. On the other hand, on a lower surface at a side opposite to the upper surface where the bump 3 is provided, a pad 15 is provide, where the pad 15 is connected to the bump 3 by a through-hole conductor. The double-sided contact sheet 4 with the bump is created by a copper-clad polyimide sheet. The pad 15 is formed by copper (Cu), Ni alloy, or the like remaining on the polyimide sheet, Cu or Ni alloy is allowed to grow by electrolytic plating in and on the through hole on the pad 15, and the through hole-conductor and the bump 3 are formed.</p> |
