| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a light-weight package for housing a semiconductor element, wherein a semiconductor element housed inside is always operated normally and stably at an appropriate temperature. SOLUTION: A base body 1, where comprising a recessed part 1a for housing a semiconductor element 4, the bottom surface of the recessed part 1a is provided with a hole part 1b, a plurality of metalizing wiring layers 6, to which being led from the inside surface of the recessed part 1a to the outside surface, an electrode of the semiconductor element 4 is connected a heat-radiation plate 2, to which is inserted and attached inside the hole part 1b of the base body 1, the semiconductor element 4 is fixed, and a lid body 3 jointed to the upper surface of the base body 1, are provided. Here, the base body 1 is formed of a mullite sintered body or glass ceramics sintered body, and the heat-radiation plate 2 is formed of a metal layer 12 (3-layered structure) comprising an adhesive layer 11a of titanium, zirconium, or vanadium or at least one kind of alloy containing them as main components and an intermediate layer 11b of copper, and a main layer 11c of molybdenum which is coated both the upper and lower surfaces of a core body 11 of unidirectional composite material.</p> |
