| 摘要 |
PROBLEM TO BE SOLVED: To provide a multilayer printed wiring board which is superior in connection reliability between conductor circuits and via holes. SOLUTION: In a multilayer printed wiring board, a part of via holes 160 connected to a lower conductor circuit 58 is brought into contact with an interlayer resin insulating layer 150, where a roughened surface 151 is formed. Thus, the via holes 160 are made difficult to the peeled from the interlayer resin insulating layer 150. Thus, peeling off of the via holes 160 from the conductor circuit 58 are prevented, even if a resin 152 is provided in the connection part of the conductor circuits 58 and the via holes 160 or if connection property between the conductor circuits 58 and the via holes 160 becomes low. |
