| 摘要 |
<p>PROBLEM TO BE SOLVED: To raise the adhesive strength between a substrate and a semiconductor chip by filling an adhesive resin in the gaps between a plurality of ball grids for heating, and connecting to the wiring pad of the substrate in temporal set state, and further melting the temporal set state under the heat at reflow for packing between the substrate and a package board. SOLUTION: A thermo-plastic resin 4 is so coated that the upper surface of a solder bump 3 appears, and, since workability is not good under noncured state, it is heated to about 100 deg.C in a heating device. Thus, the thermo-plastic resin 4 is softened and packed between the plurality of solder bumps 3 (temporal setting). Cream solders 8 are provided on a plurality of pads 7 on a substrate 6, and a semiconductor chip 2 and the target of the substrate 6 are recognized for alignment so that the wiring solder bumps 3 of the semiconductor chip 2 are arranged over them. Then it is melted again under the heat of reflow, and filled between a package substrate 1 and the substrate 6. No underfill process is required for assured joint strength between them.</p> |
