发明名称 THERMOSETTING RESIN SOLUTION COMPOSITION
摘要 <p>PROBLEM TO BE SOLVED: To obtain a solution composition which can give a cured product having improved solvent resistance and excellent adhesion to a substrate as well as heat resistance and electrical insulation properties by using an amine compound blocked with a lactone. SOLUTION: This composition contains a compound represented by the formula (wherein R is a poly- or mono-amine residue; (n) is 2-11; and (m) is 1-4) and obtained by blocking a polyamine compound or an aminoalkoxysilane compound with a lactone such as butyrolactone. The composition is obtained by mixing at least one member selected from among a polyamic acid, a polysiloxaneimide precursor, an aliphatic polyamide, etc., with 0.1-50 wt.% above blocked amine compound. The amine compound is exemplified by an aliphatic diamine such as hexamethylenediamine or an aminoalkylalkoxysilane such asγaminopropyltriethoxysilane. The polyamic acid is desirably one at least part of the main chain of which comprise aliphatic ether bonds or alicyclic ether bonds.</p>
申请公布号 JP2000355627(A) 申请公布日期 2000.12.26
申请号 JP19990168837 申请日期 1999.06.15
申请人 TORAY IND INC 发明人 TANIGUCHI MASAHARU;YOSHIOKA MASAHIRO;NOMURA AKIKO
分类号 G02B5/20;C08G59/50;C08G73/10;C09D7/12;C09D163/00;C09D179/08;(IPC1-7):C08G73/10 主分类号 G02B5/20
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