发明名称 |
High relative-permittivity B-staged sheet, high relative-permittivity prepreg, its production process, and printed wiring board comprising any one of these |
摘要 |
A high relative-permittivity B-staged sheet obtained by incorporating an insulating inorganic filler having a relative permittivity of at least 500 at room temperature into a solvent-less resin component so as to have an insultaing inorganic filler content of 80 to 99 % by weight, a high relative-permittivity prepreg obtained from the above high relative-permittivity B-staged sheet, a process for the production of the high relative-permittivity prepreg, and a printed wiring board obtained from any one of the above high relative-permittivity B-staged sheet and the high relative-permittivity prepreg. <IMAGE> <IMAGE>
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申请公布号 |
EP1097959(A1) |
申请公布日期 |
2001.05.09 |
申请号 |
EP20000309748 |
申请日期 |
2000.11.03 |
申请人 |
MITSUBISHI GAS CHEMICAL COMPANY, INC. |
发明人 |
IKEGUCHI, NOBUYUKI;SHIMODA, MASAHIRO |
分类号 |
H05K1/16;C08G59/40;C08G73/06;C08J5/24;H05K1/03;H05K3/00;(IPC1-7):C08J5/24;C09D163/00 |
主分类号 |
H05K1/16 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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