| 摘要 |
PROBLEM TO BE SOLVED: To provide a multilayer ceramic circuit board having a conductor circuit of a fine line width, a fine pitch, and a high aspect ratio and low variation in the line width and film thickness and thereby having a low resistance for the fine width, low variation in the electric resistance and characteristic impedance and a wiring density. SOLUTION: In a circuit board comprising a conductor metal part and a ceramic insulator part, metal powder of conductive paste forming the conductor metal part is admixed with ultrafine metal particles by an amount covering the entire surface of the metal powder or more, or the surface is coated and a pattern is formed on a ceramic green sheet using these pastes. Subsequently, it is heat treated at a temperature not starting decomposition of resin of the green sheet to sinter the ultrafine metal particles thus hardening the pattern. Thereafter, it is layered, hot pressed and subjected to main firing thus producing a multilayer ceramic circuit. |
