发明名称 FLIP CHIP UNDER-FILL SYSTEM AND METHOD
摘要 <p>PROBLEM TO BE SOLVED: To provide a flip chip under-fill system and method capable of continuously feeding an accurate quantity of a viscous material. SOLUTION: The system for distributing the viscous material on a substrate is provided with nozzles, a viscous material reservoir having a discharge opening, an auger valve connected between the discharge opening of the reservoir and the nozzle and weighing a variable quantity of the viscous material through the nozzle, a positioner means for moving a distribution element along a prescribed pattern in the neighborhood of the surface of the substrate, a weigher provided in the neighborhood of the substrate, receiving the weighed quantity of the viscous material from the auger valve and generating a signal indicating the weight of the material distributed at prescribed time intervals, and a control means adjusting the moving speed of the positioner means along the prescribed pattern and discharging the desired quantity of the viscous material to the auger valve on the basis of the signal from the weigher.</p>
申请公布号 JP2002203867(A) 申请公布日期 2002.07.19
申请号 JP20010343093 申请日期 2001.11.08
申请人 NORDSON CORP 发明人 BOURAS CARLOS E;LA DUONG T;GAMELIN ANDRE S;LEWIS ALAN R;MEIER MARK S;BABIARZ ALEC J
分类号 B05D1/26;B05C5/00;B05C5/02;B05C11/10;B05D7/00;B67D7/08;B67D7/18;B67D7/82;H01L21/56;H05K1/18;(IPC1-7):H01L21/56 主分类号 B05D1/26
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