| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a method for manufacturing a circuit board capable of incorporating an electronic component in the board in a high positional accuracy. SOLUTION: In order to dispose a capacitor element 13 in a through hole 21, first, one opening 21a of a through hole 21 is blocked by a sheet material 23 with an pressure sensitive adhesive 24 so that the pressure sensitive adhesive 24 is directed inside. When the element 13 is disposed in the hole 21, a filling resin 4 is filled in the hole 21 in a state in which the element 13 is stuck to the material 23, and cured. Thus, the element 13 can be disposed in the hole 21, that is, in a circuit board body 3 in the high positional accuracy.</p> |
