| 摘要 |
PROBLEM TO BE SOLVED: To improve reliability of wire connections including a down-bond and to prevent delaminations between a tab for fixing a semiconductor and a resin constructing a package as well. SOLUTION: A non-lead type semiconductor device comprises a tub exposed to one plane of molded body, a lead for hanging the tub and a plurality of leads, the semiconductor device located in the molded body and fixed on the surface of the tub with an adhesive, conductive wires for electrically connecting electrodes of the semiconductor to the leads, and conductive wires for electrically connecting the electrodes of the semiconductor to surface portions of the tub apart from the semiconductor. The tub is larger than the semiconductor so that an outer circumferential edge of the tub is located outside of the semiconductor, and a groove is formed on the tub surface between a semiconductor fixing region where the semiconductor is fixed and a wire connection region where the wires are connected so as to surround the semiconductor fixing region. A cross section of the tub is reverse trapezoid and the periphery is engaged with the package. |
