| 摘要 |
PROBLEM TO BE SOLVED: To provide structure for fitting a sensor head for wafer detection, which can fit the sensor head without applying adhesive to a thin band. SOLUTION: The band 13 is provided with a wafer loading portion 14 for loading the wafer and a support portion 15 connected with it, and an accommodation portion is located on its upper surface. The sensor head 29 is received in an accommodation portion 21 taking a shape covering from a region of the wafer loading portion 14 to a region of the support portion 15, is equipped with a detection electrode portion 33 for detecting the wafer on a side of the wafer loading portion 14, and is provided with a screw-fixed portion screw-fixed to the support portion 15 on a side of the support portion 15. Thereby, a required thickness can be obtained on a site of screw-fixing, while it is unnecessary to be anxious for a development of gas and a congeniality of material because of using no adhesive. |
