| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor device in which the generation of chip notches, chip cracks and package cracks can be prevented at the time of carrying chips or packages between processes, chip alignment at the time of cutting an adhesive layer is high and manufacturing efficiency is high. SOLUTION: The manufacturing method includes a process for forming a groove having cut depth shallower than the thickness of a semiconductor wafer from the circuit surface side of the semiconductor wafer, a process for sticking a surface protecting adhesive sheet to the circuit surface of the semiconductor wafer, a process for scraping the rear face of the semiconductor wafer up to prescribed thickness and dividing wafers into individual pieces, a process for laminating a chip fixing adhesive sheet to the rear side of an aggregate of individual chips, a process for fixing the surface protecting adhesive sheet side on a wafer mounting table while supporting the aggregate of individual chips and then cutting off the chip fixing adhesive sheet in each chip, a process for picking up each chip with the chip fixing adhesive sheet, and a process for bonding the chip on a substrate for mounting the chip through the chip fixing adhesive sheet. COPYRIGHT: (C)2005,JPO&NCIPI |
