| 摘要 |
<P>PROBLEM TO BE SOLVED: To prevent contact between bonding wires and between a bonding wire and a lead terminal in the vicinity of a connection on the side of the lead terminal, in an electronic device consisting of an electronic component and a plurality of lead terminals connected via the bonding wires. <P>SOLUTION: The electronic device 100 includes the plurality of lead terminals 12 which are provided around a semiconductor element 20 as an electronic component having one of its surfaces 20a serving as a surface for connecting the bonding wires 30 and electrically connected by the bonding wires 30. When the bonding wire 30 connected with the first lead terminal 12a which overlies on one of surfaces 20a of the element 20 in the orthogonal direction is assumed to be the second lead terminal 12b, a region toward a connection 30b of the bonding wire 30 connected with the second terminal 12b is lower than a region toward the connection 30a of the wire 30 connected with the first terminal 12a. <P>COPYRIGHT: (C)2007,JPO&INPIT |
