发明名称 ASSEMBLING STRUCTURE FOR ELECTRONIC APPARATUS AND ELECTRONIC APPARATUS WITH THE STRUCTURE
摘要 PROBLEM TO BE SOLVED: To provide an assembling structure for an electronic apparatus formed in a housing, wherein, e.g. the thickness of a fitting rib for fixing a built-in antenna and a case at the same time can be selected thinner and wherein, e.g. a mount efficiency in the housing can be enhanced and to provide an electronic apparatus adopting the structure. SOLUTION: A fitting recessed part 26 for an antenna and a fitting recessed part 27 for the case are formed such that the deepmost part of the fitting recessed part 26 for the antenna and the deepmost part of the fitting recessed part 27 for the case are located nearly at the same position along the thickness direction of the fitting rib 23 or either of the parts 26, 27 is arranged up to a position in excess of the other deepmost part along the thickness direction. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2006345326(A) 申请公布日期 2006.12.21
申请号 JP20050170174 申请日期 2005.06.09
申请人 NEC SAITAMA LTD 发明人 SASAKI AKIRA;YOSHIDA HIROSHI
分类号 H04M1/02;H01Q1/24 主分类号 H04M1/02
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