| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of a substrate for an electronic component in which the substrate can be manufactured easily even if the size is reduced. SOLUTION: A circuit board forming member 230 where a flexible circuit board 20 is coupled by a circuit board coupling portion 231, a current collection board forming member 210 where a current collection board 40 is coupled by a current collection board coupling portion 211, and a terminal forming member 250 where a first metal terminal 50 is coupled by a terminal coupling portion 251 are prepared. A substrate 60 for an electronic component is manufactured by a step for fixing the flexible circuit board 20, the current collection board 40 and the first metal terminal 50 in a die, a step for forming the substrate 60' for an electronic component with coupling portions by filling a cavity formed by the die with molten molding resin and curing the resin, and a step for separating the circuit board coupling portion 231, the current collection board coupling portion 211 and the terminal coupling portion 251 from the substrate 60' for the electronic component with coupling portions. COPYRIGHT: (C)2007,JPO&INPIT
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