发明名称 RADIATION-SENSITIVE RESIN COMPOSITION AND FORMATION OF INTERLAYER INSULATION FILM AND MICROLENS
摘要 <P>PROBLEM TO BE SOLVED: To provide a radiation-sensitive resin composition having no safety problem, superior in sensitivity, resolution and storage stability as a solution, and having such a proper development margin that a proper pattern profile can be formed, even after the lapse of the optimum developing time in a developing step, and to provide a method for forming an interlayer insulation film and microlenses from the composition. <P>SOLUTION: The radiation-sensitive resin composition contains [A] a copolymer of (a1) at least one selected from among unsaturated carboxylic acid and unsaturated carboxylic acid anhydride, (a2) a specific oxetanyl group-containing unsaturated compound and (a3) an unsaturated compound, having a lactone structure in a molecule, and [B] a 1,2-quinonediazido compound. The interlayer insulation film and microlenses are formed from the composition. <P>COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007101761(A) 申请公布日期 2007.04.19
申请号 JP20050289470 申请日期 2005.10.03
申请人 JSR CORP 发明人 YONEDA EIJI;HAMADA KENICHI;SHIHO KOUJI
分类号 G03F7/023;C08F220/02;C08F220/26;G03F7/40;H01L21/027 主分类号 G03F7/023
代理机构 代理人
主权项
地址