SEMICONDUCTOR RADIATION EMITTER PACKAGE

摘要

A semiconductor optical radiation package (200) includes a leadframe (201), at least one semiconductor optical radiation emitter (202) and an encapsulant (203). The leadframe (201) has a heat extraction member (204), which supports the semiconductor optical radiation emitter (202) and provides one or more thermal paths for removing heat generated within the emitter (202) to the ambient environment, as well as at least two electrical leads (205) for providing electrical coupling to the semiconductor optical radiation emitter (202). The encapsulant (203) covers and protects the emitter (202) and optional wire bonds (211) from damage and allows radiation to be emitted from the emitter into the ambient environment. The semiconductor optical radiatio n package (200) provides high emitted flux and is preferably compatible with automated processing techniques.