| 摘要 |
A heat radiating apparatus for a device is provided to perform heat radiation and external shock absorption simultaneously without increase of volume thereof. A heat radiating apparatus(1) includes a PCB(Printed Circuit Board)(10), a heating element(13), a metal shield can(30), and a metal shock absorber(20). The heating element is mounted on the PCB. The metal shield can is mounted on the PCB to surround the heating element. The metal shock absorber is installed between the metal shield can and the heating element to conduct heat radiated from the heating element and absorb an external shock applied to the heating element at the same time. The metal shield can is made of copper or aluminum.
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