| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To automatically and surely move cut wastes produced during cutting so as to release a sticking substance without requiring manpower and to achieve efficient correction by spending time as short as possible while preventing human errors. <P>SOLUTION: In a photomask defect correction method, which a defective portion 5 is subjected to cutting and removing processing based on observation data obtained by preliminarily observing a photomask having a substrate 2 and a mask pattern 3 with an AFM (atomic force microscope). The method includes: an area setting step of setting a process area E1 based on the observation data and setting an area adjacent to the process area as a cut waste removing process area E2 for removing cut waste that is produced by the cutting and removing process and may be sticking; a processing step of cutting and removing the defective portion with a probe in the process area; and a moving step of moving the cut waste by a cut waste removing process by scanning the cut waste removing process area with a probe under pressing force lower than the force during the cutting and removing step. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
