发明名称 SEMICONDUCTOR CHIP AND METHOD OF WRITING PROCESS DEVICE INFORMATION TO SEMICONDUCTOR CHIP
摘要 PROBLEM TO BE SOLVED: To solve a problem that after a semiconductor is formed by packaging a semiconductor chip, a burn-in test for selecting and removing a defective semiconductor element is possibly conducted to suppress an initial defect, but it is difficult to additionally store characteristic variation information generated even for a conforming semiconductor element generated as a result of the burn-in test to a semiconductor chip disposed in the semiconductor element. SOLUTION: The semiconductor chip includes an electrically writable information storage unit 9, a first bus 11 transmitting a readout signal from the information storage unit 9 and a write signal to the information storage unit 9, a second bus 14 transmitting signals from other blocks, and a switching circuit 10 which selects one of the first bus 11 and second bus 13 according to a selection signal and connects it to a data bus 12. Even after the semiconductor chip 2 is molded, information can be written, so information for log investigation can be written at any time. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009021398(A) 申请公布日期 2009.01.29
申请号 JP20070182889 申请日期 2007.07.12
申请人 SEIKO EPSON CORP 发明人 FUKUDA MASAFUMI;YASUE TADASHI
分类号 H01L21/02;H01L21/66 主分类号 H01L21/02
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