| 摘要 |
<P>PROBLEM TO BE SOLVED: To prevent electrical connection failure due to thermal expansion. <P>SOLUTION: An electronic device comprises: a semiconductor chip 10 where an integrated circuit 12 is formed; an electrode 14 that is formed in the semiconductor chip 10 and is electrically connected to the integrated circuit 12; a resin projection 18 arranged on the semiconductor chip 10; wiring 20 arranged so that it reaches the resin projection 18 from an area on the electrode 14; a wiring board 30 in which a wiring pattern 32 is formed and the semiconductor chip 10 is mounted so that a part on the resin projection 18 in the wiring 20 is electrically connected oppositely to the wiring pattern 32; and an adhesive 42 for bonding the semiconductor chip 10 to the wiring board 30. The resin projection 18 is compressed in a direction where a gap between the semiconductor chip 10 and the wiring board 30 becomes narrower and is made of a material having a negative coefficient of thermal expansion. <P>COPYRIGHT: (C)2009,JPO&INPIT |
