A sputtered film, solder spheres and solder paste formed from an Sn-Ag-Cu-In alloy

摘要

A solder sphere formed from a solder comprising: 3.0% to 4.5% silver, 0.3% to 0.7% copper, 3.4% to 7.5% indium and the balance tin. Also solder paste comprising a paste flux and an alloy comprising: 3.0% to 4.5% silver, 0.3% to 0.7% copper, 3.4% to 7.5% indium and the balance tin. Also a method of coating a target by sputtering an alloy comprising 3.0% to 4.5% silver, 0.3% to 0.7% copper, 3.4% to 7.5% indium and the balance tin onto the target.