CHIP ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF

摘要

The present invention relates to a chip electronic component capable of reducing a contact resistance between a coil pattern unit and an external electrode, and effectively discharging heat generated inside the chip electronic component. The chip electronic component comprises: a magnetic material main body; and a coil pattern unit embedded inside the magnetic material main body. The coil pattern unit includes: a spiral inner coil unit; and an extraction unit connected to an end unit of the inner coil unit, and exposed to one surface of the magnetic material main body. The thickness of the extraction unit is thicker than the thickness of the inner coil unit.